Epoxy Structural Adhesive Technical Profile
Features
Epoxy structural adhesive is a dual-component modified epoxy resin-based high-performance bonding material, featuring high strength (tensile strength ≥35 MPa), chemical resistance (acid/alkali/oil resistance), and wide temperature adaptability (-50ºC~250ºC short-term). Cured into a high-modulus layer (elastic modulus ≥12000 MPa) with zero shrinkage (≤2%), it exhibits low viscosity (A-component ≤8000 mPa·s) and thixotropic properties (anti-sagging), enabling deep penetration into porous substrates for robust interfacial bonding (steel-steel shear strength ≥25 MPa)
Advantages
- Long-term reliability: ≤10% strength loss after 90-day thermal-moisture aging, service life >10 years;
- High efficiency: Ambient curing (25ºC initial set in 3-7 days) or low-temperature acceleration (-10ºC applicable), vacuum degassing for densification;
- Eco-safety: 100% solid content, zero VOC (GB50728-2011 compliant);
- Multi-functionality: Conductive/thermal properties, suitable for electronics encapsulation and composite bonding
Applications
- Civil engineering: Bridge column bonding, concrete crack repair (tensile/shear enhancement);
- Industrial manufacturing: Automotive body assembly, engine part sealing (heat/impact resistance);
- Electronics: Chip encapsulation, PCB waterproofing (dielectric strength 16-35 kV/mm);
- Marine engineering: Seawater pipeline corrosion protection, dock steel structure bonding (salt spray resistance)
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